論文掲載：IEEE Sensors Letters
M. S. Al Farisi, Y. Wang, Y. Hasegawa, M. Shikida, Facile Packaging for Fiber-Shaped Flexible MEMS Thermal Accelerometer, IEEE Sensors Letters, Vol. 7, No. 11, p. 2504704 (2023), DOI: 10.1109/LSENS.2023.3326122 (Preprint: TechRxiv:24312913)
